Google plans to switch from Samsung to TSMC’s foundry for its Tensor chips, starting this year, and will continue the partnership for the next 3–5 years, until at least the Pixel 14.
The partnership with TSMC will enable Tensor chips to run cooler and consume less power due to TSMC’s superior process node. Tensor chips have allowed Google to provide unrivaled AI features, but their performance and thermal efficiency have lagged behind others due to Google using Samsung’s inferior foundry.
A DigiTimes report claims Google will continue its partnership with TSMC for at least 3–5 years, until at least the Pixel 14 in 2029. This should improve the thermal efficiency of the Tensor chips, ensuring they don’t overheat or run hot. The move will also put Google in the same league as Apple and Qualcomm, which rely on TSMC to fabricate their mobile chips.
A cooler chip should also help with battery life, as evident from the Pixel 9 lineup. The phone’s Tensor G4 SoC, fabricated on Samsung’s cutting-edge 3nm node, runs significantly cooler and consumes less power than previous Tensors. The new Exynos 5400 modem also helps, as it is more power-efficient than Samsung’s previous Exynos modem.
Rumors indicate Google is fabricating the Pixel 10’s Tensor G5 chip on TSMC’s 3nm node, the same foundry technology used by Apple for the iPhone 16‘s A18 SoC. TSMC’s cutting-edge process nodes are typically in high demand, with companies often signing a multi-year contract and booking capacity years in advance.
A newer process node improves power efficiency and enables denser chip designs. For Google, this means it can achieve the same performance with lower power consumption or reduce chip size for potential cost savings. However, performance gains depend on factors like higher clock speeds, updated CPU cores, and architectural optimizations, not just the manufacturing process.
