A major leak has revealed key details about Google’s future Pixel 10 and Pixel 11 smartphones, including specifications for the new Tensor G5 and G6 chips. The leak, reported by Notebookcheck, gives a glimpse into what users can expect from Google’s 2025 and 2026 flagship releases.
Leaked: Google Pixel 10 and Pixel 11 will feature Tensor G5 and G6 respectively
The leak indicates that the Pixel 10, set for release in 2025, will feature the Tensor G5 chip, which will be Google’s first processor produced by TSMC using the 3nm process. This chip marks Google’s move away from Samsung’s Exynos architecture. The G5, codenamed “Laguna,” will have a 1-5-2 CPU core configuration. This means it will include one high-performance Cortex-X4 core, five Cortex-A720 cores, and two Cortex-A520 cores, all supporting ARMv9.2. The G5 will also use an 8MB L3 cache.
The GPU in the Tensor G5 is a dual-core unit from PowerVR Imagination Technologies, clocked at 1,100 MHz. This is a change from the previous use of Mali GPUs. Notably, the G5 GPU will support ray tracing and GPU virtualization, aimed at delivering improved graphics performance.
In 2026, the Pixel 11 is expected to introduce the Tensor G6 chip, codenamed “Malibu.” The G6 will feature a new 1-6 CPU cluster, consisting of a Cortex-X930 performance core and six Cortex-A730 cores, which support ARMv9.4. This chip will also have an 8MB L3 cache but with a smaller 4MB system-level cache. The GPU will be upgraded to a three-core version, maintaining the 1,100 MHz clock speed but consuming 15% less power. According to the leak, ray tracing may be dropped in this version.
The leaked information includes expected performance benchmarks for the Tensor G5 and G6 compared to their predecessor, the Tensor G4. The G5 in the Pixel 10 is expected to achieve a Geekbench 5 single-core score of 1,532 points and a multi-core score of 5,111 points. For the Tensor G6 in the Pixel 11, expected scores are 1,760 points for single-core and 5,655 points for multi-core performance. These scores represent a substantial performance boost compared to the Tensor G4, which powers the current Pixel 9.
Other features and compatibility
The Tensor G5 and G6 will also bring enhancements in memory and connectivity. Both chips will support either LPDDR5X-8533 or LPDDR5-6400 RAM configurations. They will also offer USB 3.2 Gen 2 support, UFS 4.0 storage, and DisplayPort 1.4. The Tensor G5 and G6 will support internal displays of up to 4K at 120Hz and external displays up to 8K at 30Hz. Additionally, the Tensor G6’s image signal processor (ISP) will include five separate pipelines, allowing for improved low-light performance, cinematic bokeh effects, and up to 100x zoom.
Both Tensor G5 and G6 chips will be manufactured using TSMC’s 3nm processes—G5 on N3E and G6 on N3P—which is expected to provide significant power efficiency gains. These chips will also feature staggered HDR, 8K video recording, and playback support, catering to demanding imaging requirements.
One of the major shifts for Google’s next-generation Pixel devices is the move away from Samsung’s Exynos-based chips to an independent chipset manufactured by TSMC. The Tensor G5 and G6 represent a significant step in Google’s efforts to create a more controlled and optimized silicon architecture, aimed at better competing with other industry leaders like Qualcomm, MediaTek, and Apple.
This shift also underlines Google’s strategy to improve overall power efficiency and system stability. The choice of the 3nm process will likely help in reducing power consumption and heat output, addressing some of the concerns users had with earlier models that experienced high temperatures during demanding tasks.
The GPU in both the G5 and G6 will be sourced from PowerVR, moving away from the Mali GPUs used in previous generations. The G5 will come with a dual-core GPU supporting ray tracing, while the G6 will feature a three-core version. The leaked information suggests that Google may drop ray tracing support in the G6, but that is still unconfirmed.
The decision to possibly remove ray tracing from the Tensor G6 could be an effort to focus on efficiency, especially as ray tracing is a resource-intensive feature that might not align with Google’s goal to reduce power consumption. By removing or reducing features that aren’t widely used or don’t offer enough return in real-world scenarios, Google could optimize performance and battery life.
| Specification | Tensor G5 (Pixel 10) | Tensor G6 (Pixel 11) |
|---|---|---|
| Launch | 2025 | 2026 |
| CPU | 1x ARM Cortex-X4 (Codename: Hunter-ELP) | 1x ARM Cortex-X930 (Codename: Travis) |
| 5x ARM Cortex-A725 (Codename: Chaberton) | 6x ARM Cortex-A730 (Codename: Gelas) | |
| 2x ARM Cortex-A520 (Codename: Hayes) | ARM V9.4 Support, 8MB L3 Cache | |
| ARM V9.2 Support, 8MB L3 Cache | ||
| GPU | 2-Core, 1,100 MHz Imagination Tech DXT-48, supports ray tracing and GPU virtualization | 3-Core, 1,100 MHz Imagination Tech EXT, 15% less power consumption, could lose ray tracing |
| Cache | 8 MB SLC | 4 MB SLC |
| Memory | 4x 16-bit LPDDR5X-8533 or 4x 16-bit LPDDR5-6400 | 4x 16-bit LPDDR5X-8533 or 4x 16-bit LPDDR5-6400 |
| I/O | USB 3.2 Gen 2, UFS 4.0, DP 1.4, 2x 2 PCIe-Gen4 | USB 3.2 Gen 2, UFS 4.0, DP 1.4, 2x 2 PCIe-Gen4 |
| ISP | 200 MP or 108 MP with Zero Shutter Lag, Staggered HDR, 8K30 video recording and playback, 4K120 support | New ISP with 5 separate pipelines, ultra-lowlight support, cinematic bokeh, 100x zoom |
| DPU | Internal: 2x4K @ 120 Hz, External: 1x4K @ 120 Hz, 8K @ 30 MST | AV1 encoder |
| Node | TSMC N3E | TSMC N3P |
Google’s path forward with Pixel 10 and Pixel 11
Google’s next flagship devices, the Pixel 10 and Pixel 11, seem to continue pushing the envelope of custom hardware development. The introduction of the Tensor G5 and G6 chips indicates a clear attempt by Google to make its Pixel lineup more competitive with the major players in the smartphone space, focusing on high efficiency, custom performance features, and improved system control.
One of the most interesting aspects of these upcoming devices is the expanded use of a new ISP, especially in the G6. The improved ISP will enable better low-light photography, more advanced HDR capabilities, and increased zoom, which aligns with Google’s focus on leading the smartphone camera market.
No official confirmation from Google yet
It’s important to note that this information comes from a leaked source, not an official announcement from Google. While the leak has been reported by Notebookcheck and appears credible, it is still possible that the final specs could change as the development process continues. Google may also adjust the final design based on engineering challenges or strategic priorities.
With the expected release of the Pixel 10 in 2025 and the Pixel 11 in 2026, it’s clear that Google is planning far ahead to establish its presence in the smartphone hardware market. Shifting to TSMC and focusing on efficiency and feature improvements show Google’s intention to better compete with established brands, particularly in the premium smartphone segment.
For now, enthusiasts can only wait for more official announcements, but if these leaks are accurate, the future of Google’s Pixel lineup looks promising with a focus on better performance, power efficiency, and advanced imaging features.
Featured image credit: Kerem Gülen/Ideogram
