Ryzen AI 9 HX 370 under scope: ASUS Zenbook S16 gets its treat

AMD’s Zen 5 generation debuts with the Ryzen AI 300 series laptops, introducing the Ryzen AI 9 HX 370 chip as its flagship SoC, ahead of the desktop processors. This introduction in the Asus Zenbook S16 marks the first use of the Zen 5 architecture in a consumer device, amidst a brief postponement of the Ryzen 900 series.

Welcome aboard Ryzen AI 9 HX 370

The Ryzen AI 9 HX 370 is designed to deliver enhanced computational power and efficiency. This chip is engineered to optimize performance-per-Watt, making it an attractive solution for users seeking a blend of power and energy efficiency in their computing tasks. The SoC’s capabilities are anticipated to suit a wide range of applications from standard laptop workloads to more demanding scenarios in thin client, edge, and IoT devices.

As the newest member of the AMD processor lineup, the Ryzen AI 9 HX 370 sets preliminary expectations for the performance potential of the upcoming Ryzen 9000 series and EPYC Turin processors. This early introduction through the Asus Zenbook S16 provides a glimpse into the advanced engineering and performance enhancements that AMD has incorporated into the Zen 5 architecture.

• Architecture: Part of the “Strix Point” lineup
• Core configuration: 12 cores (4 Zen 5 cores and 8 Zen 5C cores)
• Thread count: 24 threads
• Base clock speed: 2 GHz
• Max boost clock speed: Up to 5.1 GHz
• NPU (Neural Processing Unit): XDNA 2, capable of 50 TOPS, surpassing similar offerings by competitors
• Primary use: First seen in the Asus Zenbook S16, aiming for high productivity performance
• AI capabilities: Supports applications like Amuse 2.0 with features such as image generation and paint-to-image, optimized for local AI processing
• Benchmarking performance (as per Tomshardware):
  • Geekbench 6 Scores: Single-core: 2,765, Multi-core: 13,282
  • File transfer rate: 908.45 MBps for a 25GB file
  • Video transcoding (Handbrake): Transcoded a 4K video to 1080p in 5 minutes and 9 seconds
  • Cinebench 2024 (10 runs): Started at 821.18 points, varied between high 700’s and a peak of 844.42 points
• Operational frequencies during testing:
  • Zen 5 cores: Averaged 2.67 GHz
  • Zen 5C cores: Reached up to 1.9 GHz
• Thermal performance:
  • Average CPU temperature: 73.44 Celsius during intensive testing

ASUS Zenbook S16 is the first notebook to sport Ryzen AI 9 HX 370

ASUS Zenbook S16, equipped with the Ryzen AI 9 HX 370 SoC  looks very good in Linux performance evaluations. This model is part of an initial offering alongside a nearly identical unit powered by the Ryzen AI 9 365 SoC, setting the stage for upcoming comparative reviews and detailed performance analyses.

ASUS Zenbook S16 specs and price

The ASUS Zenbook S16, featuring the Ryzen AI 9 HX 370, represents a significant step forward in the integration of AMD’s Zen 5 CPU architecture into mainstream laptop offerings. Initial tests focus on compatibility with recent software environments, including the necessity for a Linux kernel version 6.10+ and Mesa 24.2+ to fully support the RDNA3.5 integrated graphics. This setup is crucial for optimizing the performance of the integrated GPU, as earlier versions may not provide accelerated graphics capabilities.

Challenges such as kernel errors and system instability were initially observed during the benchmarking process. However, interventions by AMD Linux engineers, including the provision of updated PSP and DMCUB firmware not yet mainstreamed, have led to a stabilization of the system on the tested configurations. Users can anticipate these updates to become publicly available, ensuring enhanced stability and performance.

As the Zenbook S16 continues to undergo rigorous testing, more insights are expected to surface regarding the performance nuances of the Ryzen AI 9 HX 370 SoC under various workload scenarios. This early examination provides a promising glimpse into the potential of AMD’s latest chip technology, particularly in terms of its application in Linux environments. Stay tuned for further developments and detailed performance results in future updates.

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The integration of the XDNA Linux driver into the mainline Linux kernel is currently underway, targeting an eventual mainstream release. This development is particularly significant for users of the Ryzen AI NPU stack, with expectations set for broad availability in the Ubuntu distributions by late 2024 or early spring 2025. However, the current benchmarks are predominantly concentrated on the CPU capabilities, providing insights into the immediate performance metrics available.

An issue identified in the preliminary testing phase involved the RAPL/PowerCap CPU package, which did not report power information correctly under Linux 6.10 due to an oversight in updating the RAPL driver for Family 1Ah processors. A corrective patch has been proposed to address this, which should facilitate accurate CPU power reporting once it is accepted into the kernel and back-ported to stable series.

Another key area of focus is the handling of heterogeneous core topology. AMD engineers are actively developing AMD P-State patches to optimize the process allocation between the standard Zen 5 cores and the enhanced Zen 5C cores. While these patches have not yet been incorporated into the mainline Linux kernel, they are critical for improving system performance and efficiency. The timing for these updates is still uncertain, as they missed the Linux 6.11 merge window and are now anticipated for consideration in the Linux 6.12 cycle, with potential availability by the end of 2024.

The Ryzen AI 9 HX 370 SoC, featured in the ASUS Zenbook, includes a mix of four Zen 5 cores and eight Zen 5C cores, presenting a unique configuration that stands to benefit significantly from these ongoing developments in Linux kernel support. As these updates continue to be refined and deployed, users can expect enhanced performance and stability from their devices running the latest AMD technologies.

Featured image credit: ASUS